During the manufacture processing of the integrated circuit, hundreds
even thousands of IC are integrated on a substrate, and divided into
single tube core for encapsulation. The most traditional way of scribing
is using diamond grinding wheel, but it is easy to cause cracking on the
surface of the silicon chip because of the pressure, so it will destroy
the IC , and reduce the rate of finished products.
Laser scriber can focus the laser beam on the surface of silicon chip to
get very high power, the silicon chip is vaporized and form grooves. Out
of the grooves, it will result in concentrative stress to cut the
silicon chip along the grooves regularly; or using laser to cut the
silicon chip into the desired shape. Because of small size of the laser
focus point , small heat effected zone , and working without touch, it
can increase the using rate of the silicon chip , the rate of finished
product and the productivity by using the laser scribing on the IC chip
and solar battery silicon chip.
Typical application :
It is used to scribe and cut the Si (mono crystalline silicon, spathic
silicon etc., Ge, GaAs materials etc..
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